| PART |
Description |
Maker |
| F71610 F71610R |
USB CIR Chip for Vista (Receive Only)
|
Feature Integration Technology Inc.
|
| SOM-C3530DK-B00E SOM-C3530EVALUATIONKIT |
TI OMAP35 COM with Windows? Embedded CE 6.0
|
Advantech Co., Ltd.
|
| HT82K629A |
Windows 2000 USB+PS/2 Keyboard Encoder
|
holtek
|
| WGDB7 |
Windows Debugger for the ST7 Emulator, Simulator and Development Kit(ST7仿真器的Windows调试程序)
|
意法半导
|
| DWTC-S0157 |
Dual Windows, Single Mode Windband Tree/star Coupler
|
OPLINK Communications Inc.
OPLINK Communications I...
|
| BCM1000-BSP |
Bluetooth® Communications Software for Windows® Mobile 2003 for Smartphone
|
Broadcom
|
| 87832-1814 |
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
|
Molex Electronics Ltd.
|
| 87832-1614 |
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
|
Molex Electronics Ltd.
|
| 87832-1416 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
|
Molex Electronics Ltd.
|
| 87832-1412 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
|
Molex Electronics Ltd.
|
| 87832-3016 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
|
Molex Electronics Ltd.
|
|
